Features:
1. Advanced discharge technology is adopted, with high plasma density, stable and uniform treatment;
2. Flexible equipment layout can be installed on existing production lines or robots to achieve automatic operation;
3. Multiple nozzles can be connected in parallel, and multi-point remote control can be used to achieve large-area surface treatment;
4. Low operation cost, use nitrogen or clean compressed air;
5. Different types of nozzles can be used to meet the surface treatment requirements of different application scenarios.

Applicable fields:
1. Automobile industry
Activate the windshield glass and lamp before bonding, and clean the particle impurities (dust, additives, mold release agent, etc.) on the surface; The sealing strip shall be treated before spraying or flocking; Pretreatment before painting, coating, in mold decoration and in mold labeling of instrument panel, door or other parts; Ultra fine cleaning of aluminum frame, ceramic coating, etc.
2. Packaging printing
Surface pretreatment before bonding, printing or covering of paper and paperboard; Pretreatment of plastic packaging (plastic film, PP, PE, etc.) before inkjet, printing and spraying; Pretreatment of glass bottles and metal cans before spraying, bonding and coating.
3. Textile printing and dyeing
Fiber and yarn removal of size and softener, singeing, flame retardant coating treatment; Pretreatment of fabric or non-woven fabric dyeing, printing or combination of water-based materials; Waterproof and oil resistant coating pretreatment of functional fabrics.
4. Plastic rubber
Silicone, rubber and other materials are sprayed, printed, activated and cleaned before bonding; Pretreatment of plastic parts before printing and painting.
5. Medical industry
Pretreatment of medical soft/hard material bonding treatment; Super fine cleaning, sterilization and disinfection of implants; The surface of medical devices is sprayed with antibacterial coating.
6. Electronics industry
The surface of the circuit board is activated to ensure the permanent adhesion of the resistance paste; PCB drilling cleaning; Improve the adhesion between layers of flexible printed circuit boards.
7. Semiconductor industry
Silicon wafer nano ultra fine cleaning to remove carbohydrates and particles; Clean the chip lead before jointing.